InterDigital to Deliver SlimChip Modem Core to CapiSemi
BEIJING & KING OF PRUSSIA, Pa.--(BUSINESS WIRE)--
Capital Semiconductor Limited (“CapiSemi”) of Beijing, China and
InterDigital, Inc. (NASDAQ: IDCC) today jointly announced that CapiSemi
and InterDigital Communications, LLC have entered into a strategic
relationship for 3G technology transfer and a mutually beneficial
licensing agreement, whereby InterDigital will deliver its SlimChip™
modem core for integration into CapiSemi’s chips for 3G mobile devices.
The SlimChip modem core features 3G modem technology with HSPA compliant
with the UMTS 3GPP Release 6 standard. InterDigital® will
also provide comprehensive engineering support for the efficient
integration of the SlimChip modem core into CapiSemi’s products for the
3G cellular market. In exchange, CapiSemi and InterDigital have agreed
upon a licensing agreement that the companies believe will support
mutual success in the 3G market.
“As a well-known fundamental wireless technologies and solutions
provider, InterDigital has established itself as a respectful and
outstanding technology company in the world. We are very pleased that
CapiSemi has been able to form a strategic technology relationship with
such a competitive company which is leading the world in the development
of wireless technologies,” said Shugang Li, President of CapiSemi.
“CapiSemi will be closely working with InterDigital to develop our 3G
and 4G Baseband chip products and wireless module solutions. CapiSemi
will first use the proven 3G SlimChip Modem technology from InterDigital
in our first generation of HSPA Baseband chip products. With this as the
beginning of our successful technology cooperation, I believe that
CapiSemi and InterDigital will be able to extend our success into the
era of 4G and beyond, and to support the creation of handset industry
value chain and to build up a solid technology foundation for the
successful realization of the 'Mobile Silicon Valley' industry base
vision that is set forth by the Beijing Government for the advancement
of mobile industry in Beijing to benefit local life.”
“We’re pleased that CapiSemi has chosen our proven SlimChip modem core
for their 3G chips,” said William J. Merritt, President and Chief
Executive Officer of InterDigital. “Today, our modem core is already
shipping in millions of 3G devices around the world. We have been very
impressed by CapiSemi’s technical capabilities and ambition to become a
leading 3G chip supplier. We are confident that our joint technology
solution should enable CapiSemi to profit in the fast-growing 3G market
in China and beyond.”
About Capital Semiconductor Limited
Capital Semiconductor Limited was founded in August 2009, as
co-investment by TechFaith Group Technology Co. Ltd. (NASDAQ: CNTF) and
Beijing YiZHuang International Investment Development Co. Ltd. The
Company is headquartered in the Beijing Economic and Technology
Development Area (YiZhuang), with registered capital of 1 billion RMB.
CapiSemi is mainly focused in the research and development of mobile
communications chip technologies and wireless module products for 3G and
4G markets. CapiSemi offers highly differentiated total mobile terminal
solutions to provide mobile value added services with rich multimedia
contents to help facilitate the applications of advanced technologies
for the advancement of mobile industry in Beijing and to generally
benefit local life and give the world whole new experiences.
For more information, visit: www.capisemi.com.
About InterDigital®
InterDigital develops fundamental wireless technologies that are at the
core of mobile devices, networks, and services worldwide. We solve many
of the industry’s most critical and complex technical challenges,
inventing solutions for more efficient broadband networks and a richer
multimedia experience years ahead of market deployment. InterDigital has
licenses and partnerships with many of the world’s leading wireless
companies.
For more information, visit: www.interdigital.com.
InterDigital is a registered trademark and SlimChip is a trademark of
InterDigital, Inc.
Source: InterDigital, Inc.
Contact:
InterDigital, Inc.
Media Contact:
Jack Indekeu
+1
610-878-7800
jack.indekeu@interdigital.com
or
Investor
Contact:
Janet Point
+1 610-878-7800
janet.point@interdigital.com