KING OF PRUSSIA, Pa.--(BUSINESS WIRE)--

InterDigital, Inc. (NASDAQ:IDCC) today unveiled its SlimChip(TM) family of high performance mobile broadband solutions, offering manufacturers flexible options to accelerate their time to market with advanced 2G/3G products with HSDPA and HSUPA capabilities. The set of SlimChip products includes:

    --  high performance baseband ICs

    --  broadband modem IP, and

    --  complete reference platforms

InterDigital's SlimChip products feature a "slim" modem architecture where the modem - which provides core wireless connectivity - is separated from the applications processor and peripheral functions. This approach allows terminal unit manufacturers to customize the pre-certified modem, in a rapid and cost-efficient manner, to specific mobile broadband devices such as data cards, smart phones or feature phones.

"Several recent industry reports project strong growth for mobile broadband devices such as data cards, notebooks, and ultra mobile PCs," commented Mark Lemmo, Executive Vice President, Business Development. "Our flexible 2G/3G products are uniquely suited to serve this rapidly emerging market."

"InterDigital's ability to deliver its SlimChip ICs, licensed IP and complete reference designs is significant given the transition at the OEM and even ODM level from single-vendor to multi-vendor strategies," noted John Jackson, Vice President of Enabling Technologies at Yankee Group. "Market conditions are also favorable for expanded connectivity in numerous device categories. Beyond the performance specifications of the SlimChip products, which are considerable, InterDigital's flexibility in terms of technology delivery format is a strong match to the evolving manufacturing landscape."

SlimChip products feature advanced receiver technology with receive diversity, providing superior interference mitigation resulting in higher data speeds and better coverage. In pre-customer trials on a live network and in the lab, the SlimChip Reference Platform in an Express Card form factor has delivered true mobile broadband performance with data speeds of up to 7.2 Mbps in the downlink and 1.5 Mbps in the uplink. The SlimChip design supports speeds up to 10 Mbps in the downlink and 5.7 Mbps in the uplink respectively.

About InterDigital

InterDigital designs, develops and provides advanced wireless technologies and products that drive voice and data communications. InterDigital is a leading contributor to the global wireless standards and holds a strong portfolio of patented technologies which it licenses to manufacturers of 2G, 2.5G, 3G, and 802 products worldwide. Additionally, the company offers a family of SlimChip(TM) high performance mobile broadband modem solutions, consisting of Baseband ICs, Modem IP and Reference Platforms. InterDigital's differentiated technology and product solutions deliver time-to-market, performance and cost benefits.

For more information, visit the InterDigital website: www.interdigital.com.

InterDigital and SlimChip are trademarks of InterDigital, Inc.

Source: InterDigital, Inc.

Contact: InterDigital, Inc. Media Contact: Jack Indekeu, +1 610-878-7800 Email: jack.indekeu@interdigital.com or Investor Contact: Janet Point, +1 610-878-7800 Email: janet.point@interdigital.com